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UAV PCB control main board

10 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

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UAV PCB ESC board

12 layers, Material: S1000-2M, Thickness: 2.2±0.2mm

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12-layer RF PCB

12 layers, Material: RO4350B+TU-768, Thickness: 1.7±0.17mm

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5G RF PCB

4 layers, Material: RO4350B+TU768, Thickness: 1.6mm

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Industrial control software and hardware combination PCB

14 layers, Material: DuPont+S1000-2M, Thickness: 2.0±0.2mm

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High-density aerospace PCB

24 layers, Material: RO4350B+TU-768, Thickness: 3.2±0.32mm

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5G optical module PCB

8 layers, Material: IT968TC, Thickness: 1.0±0.1mm

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4G optical module PCB

10 layers, Material: S1000-2M, Thickness: 1.0±0.1mm

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High-speed computer golden finger card board

14 layers, Material: IT170GRA1TC, Thickness: 1.6±0.05mm

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Ultra-high speed PCB gold finger board

16 layers, Material: TU-872SLK+RO4350b, Thickness: 1.8±0.1mm

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400G high frequency PCB

10 layers, Material: IT968TC+S1000-2M, Thickness: 1.0±0.1mm

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5G high frequency PCB

4 layers, Material: RO4350B+TU768, Thickness: 1.6±0.16mm

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24-layer high-density high-speed PCB

24 layers, Material: TU872SLK, Thickness: 3.2±0.32mm

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24-layer high-density aerospace PCB

24 layers, Material: TU872SLK, Thickness: 3.2±0.32mm

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20-layer server backplane PCB

20 layers, Material: TU-872, Thickness: 5.0±0.5mm

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16-layer thick-gold PCB

16 layers, Material: S1000-2M, Thickness: 6.5mm±0.3mm

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16-layer ultra-fine pitch PCB

16 layers, Material: S1000-2M, Thickness: 2.5±0.25mm

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14-layer high-thickness-to-diameter ratio semiconductor test thick gold PCB

14 layers, Material: S1000-2M, Thickness: 5.0mm±0.5mm

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3rd-order 18-layer buried/blind via PCB

18 layers, Material: S1000-2M, Thickness: 2.1±0.21mm

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Thick gold semiconductor test PCB

16 layers, Material: S1000-2M, Thickness: 6.5mm±0.3mm

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Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

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Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

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FENIX v0.5

Excellent service, support with file queries, appropriate solutions that facilitate development work. We are very grateful for the attention given to this and other projects manufactured with PCBWay.

C.A.

Placa de comando

After manufacturing the board correctly, the team contacted me with an assembled prototype to confirm the assembly method. I thought that was amazing. After confirming my part of the assembly, the team proceeded with the production process and assembled the boards in a very professional manner. Congratulations!

Engineer

Capacidades: Capacidades PCB; Servicio de Montaje de PCBs; Fabricación de PCBs de entrega rápida; Plantillas SMD; Prototipos de PCBs; Control de calidad

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PCBWay Prototipos de PCB de forma sencilla!

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Ejemplo de placa de circuito impreso fabricada por nosotros.

UAV PCB control main board

UAV PCB ESC board

12-layer RF PCB

5G RF PCB

Industrial control software and hardware combination PCB

High-density aerospace PCB

5G optical module PCB

4G optical module PCB

High-speed computer golden finger card board

Ultra-high speed PCB gold finger board

400G high frequency PCB

5G high frequency PCB

24-layer high-density high-speed PCB

24-layer high-density aerospace PCB

20-layer server backplane PCB

16-layer thick-gold PCB

16-layer ultra-fine pitch PCB

14-layer high-thickness-to-diameter ratio semiconductor test thick gold PCB

3rd-order 18-layer buried/blind via PCB

Thick gold semiconductor test PCB

Capacidades PCB

Capacidades PCBA