20-layer server backplane PCB

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Applications

Server field

Features

High speed material + back drill

Material

TU-872

Layers

20 layers

Thickness

5.0±0.5mm

Min Hole Size

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

12:1

Surface Finish

Cotizar

Detalles del producto

The 20-layer server high-level backplane PCB is made of Tai Yao TU872SLK material and surface immersion gold technology. The PCB circuit board is widely used in data center server PCB backplanes.

Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

Producción de bajo volumen

Proceso de producción

Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

Productos de PCBA

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Servicios de envío: FedEx,UPS,DHL,China Post Air Mail,TNT,EMS ePacket,Hongkong Post Air Mail,EMS

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