14-layer high-thickness-to-diameter ratio semiconductor test thick gold PCB

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Applications

Semiconductor test

Features

Material

S1000-2M

Layers

14 Layers

Thickness

5.0mm±0.5mm

Min Hole Size

Mechanical hole 0.35mm

Min Track/Spacingh

100/90um

Minimum board thickness and hole ratio

14:1

Surface Finish

Immersion gold(ENIG) 5u"

Cotizar

Detalles del producto

14-layer high-thickness-to-diameter ratio semiconductor test thick gold board, made of Shengyi S1000-2M material, thick gold plating on the surface and other production processes. The Min Track/Spacing can reach 100/90um, and the minimum mechanical hole can reach 0.35mm. Mainly used in the field of semiconductor testing, it is an ideal choice for the field of semiconductor testing.

Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

Producción de bajo volumen

Proceso de producción

Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

Productos de PCBA

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