Estimado Cliente,
Nuestra fábrica ha reanudado la producción desde febrero 10,2020. Pero solo se reanudó parte de la producción. La producción de prototipos de PCB (<= 100 piezas) y de lotes pequeños (dentro de 1 m2) ahora solo admite la máscara de soldadura verde y el acabado superficial HASL con plomo, sin plomo HASL, oro de inmersión (ENIG). La producción por lotes está disponible para todos los colores.
Obtenga más información sobre cómo reanudar los detalles de las operaciones y actualizar >>

Prototipos de PCB de forma sencilla

Servicio completo para prototipos de PCB personalizados.


PCB Via Covering

Vias not covered

It means that the vias are exposed and the surface finish is applied to via barrel.

The solder paste might get into the vias and cause poor or non-existent solder joints.

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Tenting vias

It means that the vias are simply covering by soldermask ink.No additional process steps is required during fabrication.

Covering the annular ring and vias with soldermask ink in order to prevent exposure to the elements and reduce accidental shorting or contact with the circuit.

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Plugged Vias with non conductive media (eg. Epoxy/resin, soldermask ink)

The conductive vias in BGA requires plugged vias. Because solder paste might wick away from the intended pad and flow down into the via, then creating poor or non-existent solder joints during assembly.

The diameter of the plugged vias requires to be smaller than 0.5mm.

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