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What is HDI PCB

What is HDI PCB

High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter.


By using HDI technology, designers now can place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allows designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.

HDI pcb.jpg

HDI PCB is frequently found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices.

Advantages of HDI PCB

The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.

Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.

Function improved by HDI PCB:

1.Denser trace routing

2.More stable power

3.Reduce interference inductance and capacitance effects

4.Improve signal integrity in high-speed design

Accelerate Development with HDI Printed Circuit Boards

1.Easier to place SMD components

2.Faster routing

3.Reduce frequent relocation of components

4.More component space (also by Via-in-Pad)

Production Capability

1.High precision automatic equipment

2.Highly dificult and complex process capability

3.Professionalengineer technical team

4.Exelent smrt manufacturing cpabilty system

PCBWay is a high-tech enterprise in Shenzhen,Hangzhou, China, and France which integrates the R&D, production, design and sales of high-end PCBs. Focusing on high-end PCB design, R&D, production and sales, we provide customers with high-layer, high-speed, high-frequency, high-step, high-density, difficult HDI PCB design and other types of PCB prototyping, customization, board manufacturing and bulk online order procurement services. The company has high-end and precise PCB production equipment, professional design and production personnel, perfect and strict product quality control system, authoritative third-party certification qualification, and reliable supply chain service system.

Check PCBWay HDI PCB manufacturing capabilities in the following table:

Serial No

Item

Technical Parameters

1

Base Material

FR-4 | High Tg | Halogen-free | PTFE | Ceramic PCB | Polyimide

2

Board Type

PCB | FPC | R-FPC | HDI

3

Hignest Layer

64Layer

4

Minimum base copper thickness

1/3 OZ ( 12um )

5

Maximum finished copper thickness

8 OZ

6

Minimum trace / gap (Inner layer)

2/2mil (H/H OZ base copper)

7

Maximum produce size

609*889mm

8

Minimum trace / gap (Outer layer)

2/2mil (1/3 OZ base copper)

9

Minimum distance from hole to inner conductor

6mil

10

Minimum distance from hole to outer conductor

6mil

11

Minimum over-hole solder ring

3mil

12

Minimum component solder ring

5mil

13

Minimum BGA pads

8mil

14

Minimum BGA Pitch

0.4mm

15

Minimum Finished Hole Diameter

0.15mm(CNC)|0.1mm(Laser)

16

Maximum board thickness to hole diameter ratio

20:1

17

Minimum solder resist bridge width

3mil

18

Soldermask / circuit processing method

Film|Laser Direct Imaging

19

Minimum insulation layer thickness

2mil

20

HDI & Specialty Boards

HDI(1-7 steps)|R-FPC(2-16 layers)|High frequency mix-pressing(2-20 layers)

21

Surface Finish Type

Immersion gold (ENIG), HASL lead free, Immersion tin, Immersion silver, OSP, Full board   gold   plating,    Immersion gold + OSP


HDI PCB Samples show >>

More information check here:

HDI PCB Instant Quote


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