What is HDI PCB
High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter.
By using HDI technology, designers now can place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allows designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays.
HDI PCB is frequently found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices.
Advantages of HDI PCB
The most common reason for using HDI technology is a significant increase in packaging density. The space obtained by finer track structures is available for components. Besides, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI technology makes routing and connection easy, especially when routing between pins.
Function improved by HDI PCB:
1.Denser trace routing
2.More stable power
3.Reduce interference inductance and capacitance effects
4.Improve signal integrity in high-speed design
Accelerate Development with HDI Printed Circuit Boards
1.Easier to place SMD components
2.Faster routing
3.Reduce frequent relocation of components
4.More component space (also by Via-in-Pad)
Production Capability
1.High precision automatic equipment
2.Highly dificult and complex process capability
3.Professionalengineer technical team
4.Exelent smrt manufacturing cpabilty system
PCBWay is a high-tech enterprise in Shenzhen,Hangzhou, China, and France which integrates the R&D, production, design and sales of high-end PCBs. Focusing on high-end PCB design, R&D, production and sales, we provide customers with high-layer, high-speed, high-frequency, high-step, high-density, difficult HDI PCB design and other types of PCB prototyping, customization, board manufacturing and bulk online order procurement services. The company has high-end and precise PCB production equipment, professional design and production personnel, perfect and strict product quality control system, authoritative third-party certification qualification, and reliable supply chain service system.
Check PCBWay HDI PCB manufacturing capabilities in the following table:
Serial No | Item | Technical Parameters |
|---|
1 | Base Material | FR-4 ｜ High Tg ｜ Halogen-free ｜ PTFE ｜ Ceramic PCB ｜ Polyimide |
2 | Board Type | PCB ｜ FPC ｜ R-FPC ｜ HDI |
3 | Hignest Layer | 64Layer |
4 | Minimum base copper thickness | 1/3 OZ （ 12um ） |
5 | Maximum finished copper thickness | 8 OZ |
6 | Minimum trace / gap (Inner layer) | 2/2mil （H/H OZ base copper） |
7 | Maximum produce size | 609*889mm |
8 | Minimum trace / gap (Outer layer) | 2/2mil （1/3 OZ base copper） |
9 | Minimum distance from hole to inner conductor | 6mil |
10 | Minimum distance from hole to outer conductor | 6mil |
11 | Minimum over-hole solder ring | 3mil |
12 | Minimum component solder ring | 5mil |
13 | Minimum BGA pads | 8mil |
14 | Minimum BGA Pitch | 0.4mm |
15 | Minimum Finished Hole Diameter | 0.15mm（CNC）｜0.1mm（Laser） |
16 | Maximum board thickness to hole diameter ratio | 20:1 |
17 | Minimum solder resist bridge width | 3mil |
18 | Soldermask / circuit processing method | Film｜Laser Direct Imaging |
19 | Minimum insulation layer thickness | 2mil |
20 | HDI & Specialty Boards | HDI（1-7 steps）｜R-FPC（2-16 layers）｜High frequency mix-pressing（2-20 layers） |
21 | Surface Finish Type | Immersion gold (ENIG), HASL lead free, Immersion tin, Immersion silver, OSP, Full board gold plating, Immersion gold + OSP |
HDI PCB Samples show >>
More information check here:
HDI PCB Instant Quote
