Flexible - Prototipos de PCB de forma sencilla

The following is the usual FPC stackup information. If you need custom FPC stackup, please make note and we will manufacture according to your requirement.
Polyimide (PI) is the most commonly used thermal curing insulating material in flexible circuit processing. The thickness range of the material is generally 12.5μm (0.5mil) and 125μm (5mil). Divided into with glue and without glue, the DK with glue is 3.5, and the DK without glue is 3.3.

Single layer FPC stackup

Thickness

0.08mm
0.1mm
0.13mm
0.16mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 18um)
	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
Total thickness		83.5um

2 layer FPC stackup

Thickness

0.1mm
0.13mm
0.16mm
0.18mm
0.2mm
0.23mm
0.29mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		104um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	12.5um
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		129.5um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	20um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	20um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		156um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		187um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	20um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	20um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		201um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	35um(Finished Copper thickness 50um)
	Adhesive	20um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	20um
bottom copper layer	Copper	35um(Finished Copper thickness 50um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		235um

top coverlay	PI	12.5um
top coverlay	Adhesive	50um
top copper layer	Copper	70um(Finished Copper thickness 70um)
	Adhesive	0um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	0um
bottom copper layer	Copper	70um(Finished Copper thickness 70um)
bottom coverlay	Adhesive	50um
bottom coverlay	PI	12.5um
Total thickness		290um

4 layer FPC stackup

Thickness

0.2mm
0.26mm
0.3mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Pure gum	13um
copper 2 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 3 layer	Copper	12um
	Pure gum	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		204um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Pure gum	13um
copper 2 layer	Copper	18um
	Adhesive	13um
	PI	12.5um
	Adhesive	13um
copper 3 layer	Copper	18um
	Pure gum	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		267.5um

top coverlay	PI	25um
top coverlay	Adhesive	25um
top copper layer	Copper	18um(Finished Copper thickness 35um)
	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Pure gum	13um
copper 2 layer	Copper	18um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 3 layer	Copper	18um
	Pure gum	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	13um
bottom copper layer	Copper	18um(Finished Copper thickness 35um)
bottom coverlay	Adhesive	25um
bottom coverlay	PI	25um
Total thickness		299um

4 layer rigid-flex FPC stackup

Thickness

1.6mm

	Rigid part		Flex part
	top soldermask layer	20um
rigid-top copper layer	Copper	18um(Finished Copper thickness 35um)
	FR4	680um	PI	12.5um
	Pure gum	13um	Adhesive	15um
flex-copper 2 layer	Copper	18um	Copper	18um
	Adhesive	13um	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	13um	Adhesive	13um
flex-copper 3 layer	Copper	18um	Copper	18um
	Pure gum	13um	Adhesive	15um
	FR4	680um	PI	12.5um
rigid-bottom copper layer	Copper	18um(Finished Copper thickness 35um)
	bottom soldermask layer	20um
	Total thickness	1549um	FPC thickness	142um

6 layer FPC stackup

Thickness

0.3mm
0.37mm

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Copper	12um(Finished Copper thickness 18um)
	Adhesive	0um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Pure gum	13um
copper 2 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 3 layer	Copper	12um
	Pure gum	13um
	Coverlay	27.5um
copper 4 layer	Copper	12um
	Adhesive	0um
	PI	25um
	Adhesive	0um
copper 5 layer	Copper	12um
	Pure gum	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	0um
bottom copper layer	Copper	12um(Finished Copper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		293.5um

top coverlay	PI	12.5um
top coverlay	Adhesive	15um
top copper layer	Cooper	12um(Finished cooper thickness 18um)
	Adhesive	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Pure gum	13um
copper 2 layer	Cooper	12um
	Adhesive	13um
	PI	25um
	Adhesive	13um
copper 3 layer	Cooper	12um
	Pure gum	13um
	Coverlay	27.5um
copper 4 layer	Cooper	12um
	Adhesive	13um
	PI	25um
	Adhesive	13um
copper 5 layer	Cooper	12um
	Pure gum	13um
	PI	25um dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
	Adhesive	13um
bottom copper layer	Cooper	12um(Finished cooper thickness 18um)
bottom coverlay	Adhesive	15um
bottom coverlay	PI	12.5um
Total thickness		371.5um

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Stack-up for FPC