Prototipos de PCB de forma sencilla

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Stack-up for FPC

The following is the usual FPC stackup information. If you need custom FPC stackup, please make note and we will manufacture according to your requirement.
Polyimide (PI) is the most commonly used thermal curing insulating material in flexible circuit processing. The thickness range of the material is generally 12.5μm (0.5mil) and 125μm (5mil). Divided into with glue and without glue, the DK with glue is 3.5, and the DK without glue is 3.3.

Single layer FPC stackup

Thickness

  • 0.08mm
  • 0.1mm
  • 0.13mm
  • 0.16mm
top coverlay PI 12.5um
Adhesive 15um
top copper layer Copper 18um(Finished Copper thickness 18um)
  Adhesive 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
Total thickness   83.5um
top coverlay PI 25um
Adhesive 25um
top copper layer Copper 18um(Finished Copper thickness 18um)
  Adhesive 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
Total thickness   106um
top coverlay PI 25um
Adhesive 25um
top copper layer Copper 35um(Finished Copper thickness 35um)
  Adhesive 20um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
Total thickness   130um
top coverlay PI 12.5um
Adhesive 50um
top copper layer Copper 70um(Finished Copper thickness 70um)
  Adhesive 0um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
Total thickness   157.5um

2 layer FPC stackup

Thickness

  • 0.1mm
  • 0.13mm
  • 0.16mm
  • 0.18mm
  • 0.2mm
  • 0.23mm
  • 0.29mm
top coverlay PI 12.5um
Adhesive 15um
top copper layer Copper 12um(Finished Copper thickness 18um)
  Adhesive 0um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 0um
bottom copper layer Copper 12um(Finished Copper thickness 18um)
bottom coverlay Adhesive 15um
PI 12.5um
Total thickness   104um
top coverlay PI 12.5um
Adhesive 15um
top copper layer Copper 18um(Finished Copper thickness 35um)
  Adhesive 13um
  PI 12.5um
  Adhesive 13um
bottom copper layer Copper 18um(Finished Copper thickness 35um)
bottom coverlay Adhesive 15um
PI 12.5um
Total thickness   129.5um
top coverlay PI 12.5um
Adhesive 15um
top copper layer Copper 18um(Finished Copper thickness 35um)
  Adhesive 20um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 20um
bottom copper layer Copper 18um(Finished Copper thickness 35um)
bottom coverlay Adhesive 15um
PI 12.5um
Total thickness   156um
top coverlay PI 25um
Adhesive 25um
top copper layer Copper 18um(Finished Copper thickness 35um)
  Adhesive 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 13um
bottom copper layer Copper 18um(Finished Copper thickness 35um)
bottom coverlay Adhesive 25um
PI 25um
Total thickness   187um
top coverlay PI 25um
Adhesive 25um
top copper layer Copper 18um(Finished Copper thickness 35um)
  Adhesive 20um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 20um
bottom copper layer Copper 18um(Finished Copper thickness 35um)
bottom coverlay Adhesive 25um
PI 25um
Total thickness   201um
top coverlay PI 25um
Adhesive 25um
top copper layer Copper 35um(Finished Copper thickness 50um)
  Adhesive 20um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 20um
bottom copper layer Copper 35um(Finished Copper thickness 50um)
bottom coverlay Adhesive 25um
PI 25um
Total thickness   235um
top coverlay PI 12.5um
Adhesive 50um
top copper layer Copper 70um(Finished Copper thickness 70um)
  Adhesive 0um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 0um
bottom copper layer Copper 70um(Finished Copper thickness 70um)
bottom coverlay Adhesive 50um
PI 12.5um
Total thickness   290um

4 layer FPC stackup

Thickness

  • 0.2mm
  • 0.26mm
  • 0.3mm
top coverlay PI 12.5um
Adhesive 15um
top copper layer Copper 12um(Finished Copper thickness 18um)
  Adhesive 0um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Pure gum 13um
copper 2 layer Copper 12um
  Adhesive 0um
  PI 25um
  Adhesive 0um
copper 3 layer Copper 12um
  Pure gum 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 0um
bottom copper layer Copper 12um(Finished Copper thickness 18um)
bottom coverlay Adhesive 15um
PI 12.5um
Total thickness   204um
top coverlay PI 12.5um
Adhesive 15um
top copper layer Copper 18um(Finished Copper thickness 35um)
  Adhesive 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Pure gum 13um
copper 2 layer Copper 18um
  Adhesive 13um
  PI 12.5um
  Adhesive 13um
copper 3 layer Copper 18um
  Pure gum 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 13um
bottom copper layer Copper 18um(Finished Copper thickness 35um)
bottom coverlay Adhesive 15um
PI 12.5um
Total thickness   267.5um
top coverlay PI 25um
Adhesive 25um
top copper layer Copper 18um(Finished Copper thickness 35um)
  Adhesive 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Pure gum 13um
copper 2 layer Copper 18um
  Adhesive 0um
  PI 25um
  Adhesive 0um
copper 3 layer Copper 18um
  Pure gum 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 13um
bottom copper layer Copper 18um(Finished Copper thickness 35um)
bottom coverlay Adhesive 25um
PI 25um
Total thickness   299um

4 layer rigid-flex FPC stackup

Thickness

  • 1.6mm
  Rigid part Flex part
  top soldermask layer 20um    
rigid-top copper layer Copper 18um(Finished Copper thickness 35um)    
  FR4 680um PI 12.5um
  Pure gum 13um Adhesive 15um
flex-copper 2 layer Copper 18um Copper 18um
  Adhesive 13um Adhesive 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 13um Adhesive 13um
flex-copper 3 layer Copper 18um Copper 18um
  Pure gum 13um Adhesive 15um
  FR4 680um PI 12.5um
rigid-bottom copper layer Copper 18um(Finished Copper thickness 35um)    
  bottom soldermask layer 20um    
  Total thickness 1549um FPC thickness 142um

6 layer FPC stackup

Thickness

  • 0.3mm
  • 0.37mm
top coverlay PI 12.5um
Adhesive 15um
top copper layer Copper 12um(Finished Copper thickness 18um)
  Adhesive 0um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Pure gum 13um
copper 2 layer Copper 12um
  Adhesive 0um
  PI 25um
  Adhesive 0um
copper 3 layer Copper 12um
  Pure gum 13um
  Coverlay 27.5um
copper 4 layer Copper 12um
  Adhesive 0um
  PI 25um
  Adhesive 0um
copper 5 layer Copper 12um
  Pure gum 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 0um
bottom copper layer Copper 12um(Finished Copper thickness 18um)
bottom coverlay Adhesive 15um
PI 12.5um
Total thickness   293.5um
top coverlay PI 12.5um
Adhesive 15um
top copper layer Cooper 12um(Finished cooper thickness 18um)
  Adhesive 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Pure gum 13um
copper 2 layer Cooper 12um
  Adhesive 13um
  PI 25um
  Adhesive 13um
copper 3 layer Cooper 12um
  Pure gum 13um
  Coverlay 27.5um
copper 4 layer Cooper 12um
  Adhesive 13um
  PI 25um
  Adhesive 13um
copper 5 layer Cooper 12um
  Pure gum 13um
  PI 25um
dielectric constant 3.3~3.5 (The DK value is not absolute and will vary depending on the base material's models and thickness.)
  Adhesive 13um
bottom copper layer Cooper 12um(Finished cooper thickness 18um)
bottom coverlay Adhesive 15um
PI 12.5um
Total thickness   371.5um
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