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High-speed computer golden finger card board

Applications
Data center high-end server field
Features
/
Material
IT170GRA1TC
Layers
14 Layers
Thickness
1.6±0.05mm
Min Hole Size
Mechanical hole 0.2mm
Min Track/Spacingh
75/75um
Minimum board thickness and hole ratio
8:1
Surface Finish
Immersion gold(ENIG) 0.05um+Golden finger 15u"
Cotizar
Detalles del producto

The high-speed computer gold finger card board is manufactured by Lianmao IT170GRA1TC high-speed material pure pressure, surface immersion gold and gold finger immersion thick gold and other production processes. It is widely used in high-speed computers and high-end server fields in cloud data centers. The products are stable, Durable and other characteristics.

High-frequency-and-high-speed-4-1.jpg

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