Semiconductor test 4th-order HDI board

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Applications

Semiconductor test

Features

Material

S1000-2M

Layers

8 Layers

Thickness

4.4±0.4mm

Min Hole Size

Laser hole 0.1mm; mechanical hole 0.3mm

Min Track/Spacingh

127/85um

Minimum board thickness and hole ratio

15:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Detalles del producto

The semiconductor test 4th-order HDI board is manufactured by laser drilling, surface immersion gold and other processes, and the smallest aperture can reach 0.1mm, and the Min Track/Spacing can reach 127/85um. The HDI board is widely used in the field of semiconductor testing.

Capacidades PCB

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Estructura laminada multicapa

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Prototipado de PCB

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Proceso de producción

Productos PCB

FAQ sobre PCB

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Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

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Perfectly finished and quickly delivered with no hassles. The board is exactly as designed and expected, the ENIG finish makes it so much easier to work on, worth every penny.

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