7th-order arbitrary interconnection HDI buried/blind via circuit board

Productos PCB / HDI PCB / 7th-order arbitrary interconnection HDI buried/blind via circuit board

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Applications

High-end smartphones, etc

Features

Material

S1000-2M

Layers

16 Layers

Thickness

1.8±0.13mm

Min Hole Size

Laser hole 0.1mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

Surface Finish

Immersion gold(ENIG) 2u"

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Detalles del producto

The "7th generation HDI (High Density Interconnect) PCB circuit board with arbitrary interconnections" is one of the series of 7th generation HDI PCB circuit boards developed and manufactured by PCBWay. This particular 7th generation HDI circuit board is fabricated using Shengyi S1000-2M material and undergoes multiple processes such as laser drilling and lamination. The 7th generation HDI board finds extensive applications in high-end smartphones and other similar industries.

Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

Producción de bajo volumen

Proceso de producción

Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

Productos de PCBA

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This new Bat Synth works perfectly

A very, very easy build, and the finished device works perfectly. Note that my photos show a previous generation of the 3D printed case which required a bit of manual trimming around the amp module.

Phil Atkin

Fuse Sensor

Of the 18 boards populated, 1 failed to operate, 1 had issues. The other 16 were operational. The process was pretty seamless - a few issues from my end regarding BOM descriptions, but otherwise all good. I will probably look at some advanced verification next time to ensure better yield rates.

Lucinsky

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Servicios de envío: FedEx,UPS,DHL,China Post Air Mail,TNT,EMS ePacket,Hongkong Post Air Mail,EMS

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