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Mobile phone 3rd-order HDI board

Applications
Smart phone
Features
/
Material
S1000-2M
Layers
12 Layers
Thickness
1.2±0.1mm
Min Hole Size
Laser hole 0.1mm
Min Track/Spacingh
65/65um
Minimum board thickness and hole ratio
/
Surface Finish
Immersion gold(ENIG)
Cotizar
Detalles del producto

The mobile phone's 3rd-order HDI PCB has a Min Track/Spacing of 65/65um and a minimum aperture of 0.1mm. This type of HDI circuit board is widely used in the field of smart phones.

hdi-15-1.jpeg

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