6th-order arbitrary interconnection HDI buried/blind via circuit board

Productos PCB / HDI PCB / 6th-order arbitrary interconnection HDI buried/blind via circuit board

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Applications

Digital products and automotive electronics

Features

Material

S1000-2M

Layers

14 Layers

Thickness

1.6±0.1mm

Min Hole Size

Laser hole 0.15mm; mechanical hole 0.20mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

8:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Detalles del producto

6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.

Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

Producción de bajo volumen

Proceso de producción

Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

Productos de PCBA

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Excellent service, support with file queries, appropriate solutions that facilitate development work. We are very grateful for the attention given to this and other projects manufactured with PCBWay.

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Placa de comando

After manufacturing the board correctly, the team contacted me with an assembled prototype to confirm the assembly method. I thought that was amazing. After confirming my part of the assembly, the team proceeded with the production process and assembled the boards in a very professional manner. Congratulations!

Engineer

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