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6th-order arbitrary interconnection HDI buried/blind via circuit board

Applications
Digital products and automotive electronics
Features
/
Material
S1000-2M
Layers
14 Layers
Thickness
1.6±0.1mm
Min Hole Size
Laser hole 0.15mm; mechanical hole 0.20mm
Min Track/Spacingh
75/75um
Minimum board thickness and hole ratio
8:1
Surface Finish
Immersion gold(ENIG) 0.05um
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Detalles del producto

6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.

hdi-8-1.jpg

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