6th-order arbitrary interconnection HDI buried/blind via circuit board

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Applications

Digital products and automotive electronics

Features

Material

S1000-2M

Layers

14 Layers

Thickness

1.6±0.1mm

Min Hole Size

Laser hole 0.15mm; mechanical hole 0.20mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

8:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Detalles del producto

6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.

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