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3rd-order 5G IoT HDI PCB

Applications
5G Internet of Things
Features
/
Material
S1000-2M
Layers
8 Layers
Thickness
1.0±0.1mm
Min Hole Size
Laser hole 0.1mm; mechanical hole 0.20mm
Min Track/Spacingh
55/55um
Minimum board thickness and hole ratio
8:1
Surface Finish
Immersion gold(ENIG)+OSP
Cotizar
Detalles del producto

The 3rd-order 5G IoT HDI PCB is made of Shengyi S1000-2M material through 8 lamination, surface immersion gold and OSP and other processes. The HDI circuit board is widely used in the field of 5G Internet of Things.

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quotesI am impressed with the quality of the boards, the delivery time and responce to all my questions. Best price excellent service and speedy delivery. When I need another board I will certainly use this supplier. "

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quotesспасибо за платы! платы очень хорошего качества. надежный продавец. оперативно отвечал на вопросы. заказ выполнили и отправили очень быстро.Заказываю платы не в первый раз - как всегда только лучшие впечатления. 5+++. 4 числа отправил файлы 26-го забрал на почте в Москве."

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