3rd-order 5G IoT HDI PCB

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Applications

5G Internet of Things

Features

Material

S1000-2M

Layers

8 Layers

Thickness

1.0±0.1mm

Min Hole Size

Laser hole 0.1mm; mechanical hole 0.20mm

Min Track/Spacingh

55/55um

Minimum board thickness and hole ratio

8:1

Surface Finish

Immersion gold(ENIG)+OSP

Cotizar

Detalles del producto

The 3rd-order 5G IoT HDI PCB is made of Shengyi S1000-2M material through 8 lamination, surface immersion gold and OSP and other processes. The HDI circuit board is widely used in the field of 5G Internet of Things.

Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

Producción de bajo volumen

Proceso de producción

Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

Productos de PCBA

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Perfectly finished and quickly delivered with no hassles. The board is exactly as designed and expected, the ENIG finish makes it so much easier to work on, worth every penny.

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Servicios de envío: FedEx,UPS,DHL,China Post Air Mail,TNT,EMS ePacket,Hongkong Post Air Mail,EMS

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