Inconformity of solder joints and pads on board

Question: More/less solder joints on component than the pads designed on board.

Answer:

A: Solder as they are if it is OK NOT to solder the extra solder joints/pads

B: Remake new PCB by removing/adding the extra/missing pads.

C:Provide new part number for suitable component.

图片8.png

Artículos relacionados

The question of component dimension is bigger than the land pattern in the design.
The question of component dimension don’t match the pads on the boards.
The question of the component gap don’t match the boards thickness
The question of component lead pin height don’t match the boards thickness
The question of component lead pin don’t match pads quantity in the design
The question of tooling pin/tooling hole
The question of pin header don’t match the holes on the boards
The question of Sink Type Micro USB
Special requests for PCB and assembly making
The question for holes on pads
Design issue caused poor soldering
The question for pin pitch
Inconformity for component pin distance and the hole space
The question for missing soldermask opening
The question for LED package
The question of positioning pin
The question of silkscreen marking cannot match with the component
The question of component package
The question of FPCB stiffener for THT pad

Comentarios (0)

Este mensaje aquí es solo una sugerencia que complementa el contenido anterior y no para operaciones comerciales como pedidos. Si tiene alguna pregunta urgente o problemas con el pedido, comuníquese con su representante de ventas.

Sube una foto: Solo puede subir 1 archivo en total. Cada archivo no se puede exceder los 2 MB. Admite JPG, JPEG, GIF, PNG, BMP

0 / 10000