Semiconductor test PCB

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Applications

Semiconductor test

Features

4 times laser drilling, 5 times pressing, 4nd order HDI board

Material

S1000-2M

Layers

8 Layers

Thickness

4.4±0.4mm

Min Hole Size

Laser hole 0.127mm; mechanical hole 0.3mm

Min Track/Spacingh

127/85um

Minimum board thickness and hole ratio

15:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Detalles del producto

Semiconductor test PCB circuit board, this type of circuit board is made of Shengyi S1000-2M material, manufactured by laser drilling, surface immersion gold and other processes, and the smallest aperture can reach 0.1mm, and the Min Track/Spacing can reach 127/85um. The HDI board is widely used in the field of semiconductor testing.

Capacidades PCB

Capacidades avanzadas de PCB

Estructura laminada multicapa

Fabricación de PCB

Prototipado de PCB

Producción de bajo volumen

Proceso de producción

Productos PCB

FAQ sobre PCB

Capacidades PCBA

Capacidad PCBA

recordatorios especiales

Requirimientos de archivos

FAQ Montaje PCB

Proceso de producción

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