Hybrid Mixed Pressure Aluminum Base Board

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Substrate Material

Aluminum Base

Board Thickness/Copper Thickness

2.0mm/70um

Thermal Conductivity

1.0-5.0W/m.k

Surface Treatment

HAL/OSP/HASL(LF)

Breakdown Voltage

1.5-3.0KV(DC)

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Detalles del producto

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