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Wicking

Capillary absorption of liquid along the fibres of the base material.

Whisker

A needle-shaped metallic growth on a printed circuit board.

Wetting

The formation of a relatively uniform, smooth, unbroken and adherent film of solder to a base material.

Weave Exposure

A condition of base material in which a weave pattern of glass cloth is appearing on the surface though the unbroken fibres of the woven cloth are completely covered with resin.

Wave Soldering

The technique of joining parts to a PCB by passing the assembly over a wave of molten solder so as to coat the pre-fluxed areas to be joined.

Wave Exposure

A surface condition of base material in which the unbroken fibres of woven glass cloth are not completely covered by resin.

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