A screening defect characterized by prints having jagged edges, the result of incorrect moving pressure.
The process of immersing printed circuit boards into hot liquids. Often referred to as HASL or HAL (Hot Air Levelling).
A preferable concave surface of solder that is at the interconnection of the metal surfaces of a solder connection.
A small hole that penetrates from the surface of a solder connection to a void of indeterminate size within the solder connection (process indicator).
The period after pre-heat and before re-flow peak temperature where the internal temperature differences between parts allowed to equalize.
The return of a stencil to normal level after deflection by the pressure of the squeegee moving across the surface.
The space between the top surface of the substrate and the underside of the stencil when the squeegee is not in play.
Surface Mount Technology. Defines the entire body of processes and components which create printed circuit assemblies without components with leads that pierce the board.
Resin, smeared over the edge of an internal copper layer of a multi-layer board during drilling, which prevents the layer from making electrical contact with the barrel of the hole.
Surface Mounted Device. Any component or hardware element designed to be mounted to a printed circuit board (PCB) without penetrating the board.
A spreading of the solder paste after printing but before re-flow soldering. If excessive, a loss of definition may result.
A production master used in the process of making a single printed board.
The process of creating a virtual representation(a computer model)of an electronic component, circuit board, or system and applying virtual test signals to the model to verify its functionality and po...
Often used for legend print and means the printed reference designators on a printed wiring boards.
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1 | PCBWay Team | 5 |