A portion of a conductive pattern usually, but not exclusively, used for the connection and/or attachment of components.
A printed board fabrication method of covering over plated through-holes and the surrounding conductive pattern with a resist, usually dry film.
A via with solder mask completely covering both its pad and its plated through-hole. This completely insulates the via from foreign objects, thus protecting against accidental shorts, but it also rend...
The depiction of the temperature that a selected point traverses as it passes through the re-flow process.
A packaging method of housing surface-mount parts in their own tape cavities in a long continuous strip. The cavities are covered so that the tape can be wound around a reel for convenient handl...
A component lead wire that extends through a hole in a printed board and its lead extension is flattened(swaged)to secure the component to the board during manufacturing operations.
A chemical added to the cleaning solution to lower surface tension and to promote wetting.
The natural, inward, molecular attraction force that inhibits the spread of a liquid at its interface with a solid material.
The electrical connection of components to the surface of a conductive pattern that does not utilize component holes.
The passage of current over the boundary surface of an insulator as distinguished from passage through its volume.
A measure in ohms of an insulating material’s (as in FR-4) electrical resistance between conductors.
Test for the level of resistance of an insulating material, such as FR-4.between conducting members of a board (traces, contacts).
A hole in a printed board that has its inside surface plated or otherwise reinforced.
A process for obtaining conductive patterns by selective removal of unwanted areas of conductive foil from a metal clad base material.
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1 | PCBWay Team | 5 |