Mar 25, 2014
Nordson YESTECH debuted its FX-940 AOI Inline PCB inspection system in Booth #2025 at the upcoming IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, USA. The FX-940 is the latest automated solution for the inspection of solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs and other height-sensitive devices.
Nordson YESTECH’s advanced nine megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera, four side-viewing cameras and 3D inspection, the FX-940 inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.
Configurable for all line positions, the FX-940 is equally effective for paste, pre / post-reflow and final assembly inspection. Fast and intuitive off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. Advanced Fusion Lighting and newly available image processing technology integrates several techniques including 3D inspection, color inspection, normalized correlation and rule-based algorithms to provide complete inspection coverage with an unmatched low false failure rate.
