Keyword: PCB surface, circuit PCB , PCB design
Double panel process is as follows:
cutting plate → drill → The outer line → solder resist →character → surface treatment → molding →Will pick up
1. cutting plate
2.drill
Through drilling connect different between layer and layer
3. The outer process
1) hole metallization
Hole in the drill hole wall surface copper cover of connectivity
2) graphic transfer
Form a line graphic cover line transfer
3) copper plating
Increase the outer lines and distributed copper thick wall, improve electrical conductivity and reliability
4) etching and film
Eventually form the outer line graph
4. The resistance welding process
In order to prevent external environment and good for assembly, after completion of the outer circuit PCB build a layer on the surface of protective isolation layer
Resistance welding process equipment
5. Printing element symbol
6. Surface treatment process
To prevent external environment and conducive to assembly, after completion of the resistance welding way of PCB bare lines into a surface layer connectivity of inert isolation layer.
Hot Air Leveling
7. Forming process: the puzzle size by forming process with the PCB design size and geometry shape
V - shaped groove: according to the specifications in the PCB surface form a v-shaped slot and standard
8. Final inspection
In order to ensure the quality of the finished product delivery of PCB, for special products and provide electrical test sample performance test
Source: //www.seekic.com
